IC Package Development Manager, Signal and Power Integrity

Job title:

IC Package Development Manager, Signal and Power Integrity

Company

Marvell

Job description

About MarvellMarvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.Your Team, Your Impact Marvell’s Central Engineering team is seeking a talented High-speed IC package development manager to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The manager will be responsible for managing the team that is involved in package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The manager will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The manager will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.What You Can Expect

• Strong fundamentals in EM, transmission lines and microwave theory
• Experience in managing high performance technical teams.
• Familiarity of using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
• Experience with 2.5D/3D package development is highly desired.
• Proven track record of new product introduction from concept, through development and production
• Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.
• Capability to do resource management for the package development life cycle
• Understanding of IC package layout tools like APD or PADS
• Drive automation of SI, PI and Packaging activities using scripting tools like Python
• Manage engineers doing VNA and TDR measurements for package and PCB characterization.
• Understanding of power plane design, modeling and analysis using tools like PowerSI, SIwave
• Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
• Knowledge of the thermal and mechanical analysis of the IC package development is a plus.
• Experience with channel simulations using MATLAB or ADS or other tools is a plus.
• Strong communication, presentation, and documentation skills
• Ability to look after the well being of the team to ensure that team is performing efficiently.

What We’re Looking ForBachelor’s degree in computer science, Electrical Engineering or related fields and 10-15 years of related professional experience.Master’s degree and/or PhD in Computer Science, Electrical Engineering, or related fields with 8-10 years of experience.#LI-TD1Additional Compensation and Benefit ElementsWith competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it’s like to work at Marvell, visit our page.All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Expected salary

Location

Ottawa, ON

Job date

Tue, 16 Jul 2024 23:28:06 GMT

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